负温度系数热敏电阻专利发展态势分析 | |
陈松丛![]() ![]() | |
2018 | |
Document Type | 研究报告 |
Identifier | http://ir.las.ac.cn/handle/12502/10153 |
Collection | 中国科学院兰州文献情报中心_科技咨询服务部 |
Affiliation | 中国科学院兰州文献情报中心 |
Recommended Citation GB/T 7714 | 陈松丛,辛小萍. 负温度系数热敏电阻专利发展态势分析. 2018. |
Files in This Item: | There are no files associated with this item. |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment