| 负温度系数热敏电阻专利发展态势分析 | |
陈松丛 ; 辛小萍
| |
| 2018 | |
| Document Type | 研究报告 |
| Identifier | http://ir.las.ac.cn/handle/12502/10153 |
| Collection | 中国科学院兰州文献情报中心_科技咨询服务部 |
| Affiliation | 中国科学院兰州文献情报中心 |
| Recommended Citation GB/T 7714 | 陈松丛,辛小萍. 负温度系数热敏电阻专利发展态势分析. 2018. |
| Files in This Item: | There are no files associated with this item. | |||||
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